Apple To Ramp Up UWB Chip Production For AirTags In Q2-Q3 2020

Respected analyst Ming-Chi Kuo has issued a new research note via TF Securities in which he says that Apple’s partners are set to ramp up production of ultra-wideband (UWB) parts this year.

According to a new research note by Kuo, Asahi Electronics will produce “tens of millions” of SiPs for Apple’s AirTags in the second and third quarter of 2020. Those SiPs, or system-in-package, will be used in the ultra-wideband parts that will be the heart of the new accessories.

We expect Universal Asahi Electronics to begin shipping SiPs for UWB tags in 2–3Q20, with shipments reaching tens of millions in 2020.

We believe that UWB tags can enhance the iOS search and AR application experience through the close-range measurement function. We expect Huaxu to be the main supplier of SiP for UWB tags, with a supply ratio of approximately 60%.

By ramping production up, it’s likely that we can expect AirTags to be released in or around iPhone season in September. With a new media event thought to be taking place next month – with new iPad Pro and iPhone 9 to be announced – it’s possible the Tile-like trackers will make an appearance. But even if they do, we don’t expect any release to take place.

The UWB chips are already present in the iPhone 11 and iPhone 11 Pro, with more devices set to make use of them throughout Apple’s product lines in the future.

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