Work On Apple M2 Chips Continues With The Help Of A Surprising Company
Apple continues to work on getting the M2 version of its speedy Mac chips ready for release, and now a new report claims that the company is working with Samsung Electro-Mechanics to finish the job.
Samsung Electro-Mechanics supplies the flip chip ball grid array (FC-BGA) that is already being used on the M1 chip and it now appears that the company is working on an upgraded version that will be used for the new M2 chips later this year.
Samsung Electro-Mechanics participated in the Apple M2 development project because it received high scores from supplying the high-spec substrates for the M1 series. There is a handful of companies that can reliably supply FC-BGA to Apple. Despite Taiwan and Japan investing trillions in FC-BGA, Apple has a small number of companies, such as Japan’s Ibiden and Taiwan’s Unimicron, that supply FC-BGA. Unlike other substrates, FC-BGA requires an advanced technology that makes it difficult to enter the FC-BGA business.
Future M2 chips will also presumably include the M2 Pro, M2 Max, and M2 Ultra. It still isn’t clear which of the chips will be used in a future Apple Mac Pro, however. The Mac Pro is the last Mac to be moved to Apple silicon.