Newly Leaked iPhone 14 Pro Schematics Show Large Camera Bump, New Notchless Design, More

Apple is expected to announce its new iPhone 14 lineup later this year with the iPhone 14 Pro and iPhone 14 Pro Max sitting at the very top of the pile. Those two devices have now leaked in the form of detailed schematics that show just what we should expect from both releases.

The new schematics were shared online by Max Weinbach and show that the new iPhone 14 Pro devices could have a camera bump that’s more noticeable than previous versions.

The overall thickness of the iPhones is also set to increase, according to these schematics.

As an example, the iPhone 14 Pro Max will be 7.85mm thick, slightly thicker than last year’s iPhone 13 Pro Max that measured 7.65mm. MacRumors notes that the camera bump is set to gain in thickness, too.

The current camera bump on the ‌iPhone 13 Pro‌ Max is just 3.60 mm tall, according to guidelines created by Apple for accessory makers to follow. According to the ‌iPhone 14 Pro‌ Max schematics shared by Weinbach, the camera bump on the 2022 high-end ‌iPhone‌ will be 4.17 mm thick. The camera plateau itself on the back of the ‌‌iPhone‌‌ will also increase in size by about 5% in each dimension, going from the current width of 35.01 mm to 36.73 mm and height of 36.24 mm to 38.21 mm.

All of these flies in the face of leaks from last year that suggested we should expect the iPhone 14 Pro Max to do away with the camera bump entirely, making the back of the device completely flat. That now seems very unlikely given the schematics that have appeared today.

Apple is expected to announce new iPhone 14, iPhone 14 Max, iPhone 14 Pro, and iPhone 14 Pro Max devices in or around September 2022. The two higher-end devices will ditch the notch in favor of a pill+hole design, something that’s also backed up by these schematics.

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